Methode Electronics | MEI - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
Aac Technologies CNY 92.54M 53.15M 2024-12
Amphenol USD 207.9M 78.2M 2026-03
Applied Optoelectronics USD 843K 59K 2025-12
Bel Fuse USD 2.89M 737K 2025-12
Benchmark Electronics USD 3.65M 771K 2026-03
Cognex USD -3.92B 5.92B 2025-12
CTS USD 1.11M 10K 2025-09
Daktronics USD 71K 5.28M 2024-07
Dolby Laboratories USD 9.88M 2.55M 2025-12
Enerpac Tool Group USD 2.26M 151K 2026-03
IPG Photonics USD 7.1M 310K 2025-12
Jabil Circuit USD 63M 5M 2025-09
Knowles USD 1.5M 2.22B 2026-03
Littelfuse USD 6.98M 1.3M 2026-03
Methode Electronics USD 4.4M 1.6M 2023-09
Osi Systems USD 3.99M 6.72M 2026-03
Plexus USD 3.42M 534K 2026-03
Sanmina USD 32.46M 326K 2026-06
TE Connectivity USD 31M 1000K 2026-06
TTM Technologies USD 12.38M 1.98M 2025-12